MULTI-PRIDE: a system for supporting multi-layered printed wiring board design
نویسنده
چکیده
The purpose of the paper is to outline MULTI-PRIDE, a system for supporting multi-layered printed wiring board design. It consists of (i) circuit bipartition, (ii) placement and routing on each outside layer, (iii) modi cation of wiring and compaction, and (iv) routing on inside layers.
منابع مشابه
AN - 9037 Assembly Guidelines for 8 x 8 MLP DriverMOS Packaging
INTRODUCTION The Fairchild 8x8 DriverMOS package is based on Molded Leadless Packaging (MLP) technology. This technology has been increasingly used in packaging for power related products due to its low package height, excellent thermal performance with large thermal pads in the center of the package which solder directly to the printed wiring board (PWB) and allow modularity in package design,...
متن کاملApplication Note AN 9046 Assembly Guidelines for Dual Power 56 Packaging
INTRODUCTION The Fairchild Dual Power56 package is based on Molded Leadless Packaging (MLP) technology. This technology has been increasingly used in packaging for power related products due to its low package height, excellent thermal performance with large thermal pads in the center of the package which solder directly to the printed wiring board (PWB). Modularity in package design, single an...
متن کاملDS33R11 Multichip-Module BSDL Testing - AN4118
This application note describes how to alter the printed wiring board (PWB) netlist of a design containing the DS33R11T1/E1/J1 transceiver so that the netlist complies with the Joint Test Action Group (JTAG) specifications. These alterations are necessary because the DS33R11 was designed as a multichip module with multiple die in a single package which cannot be defined by the Boundary-Scan Des...
متن کاملDS33R41 Multichip-Module BSDL Testing - AN4059
This application note describes how to alter the printed wiring board (PWB) netlist of a design containing the DS33R41 Inverse-Multiplexing Ethernet Mapper with Integrated Quad Port T1/E1/J1 Transceiver so that the netlist complies with the Joint Test Action Group (JTAG) specifications. These changes are necessary because the DS33R41 was designed as a multichip module with multiple die in a sin...
متن کاملThe state of the art in printed wiring board inspection
Automated visual inspection of printed wiring is providing research opportunities in completely utomated optical systems technology. This paper addresses device design considerations, articularly the important problem of turning an optical inspection device into a tool for lanufacturing process analysis and control.
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
عنوان ژورنال:
دوره شماره
صفحات -
تاریخ انتشار 1997